Computed Controlled Cutting
This is the first week we will be using machines in the lab, specifically a vinyl cutter and a laser (Light Amplification by Stimulated Emission of Radiation) cutter. I am today years old when I learned that "laser" is an abbreviation.
I have used a laser cutter many times before, but mostly for decorative purposes. This is why it is the first time I have learned about kerf. I understand that the laser cutter works by burning through the material, but it never occurred to me until now that the width of it is quite substantial and varies from one material to another.
In class, we were also introduced to a multitude of methods machines perform cuts. The vinyl cutting in our lab uses a knife, and the laser uses a CO2 laser. There are machines that use a knife that can adjust its angle, ultrasonic knife, fiber laser, plasma, water, and wire. I used to think laser was the more precise way of cutting; now I know that it actually ranks quite low on the precision scale.
I always wondered why the vinyl cutter is listed as a requirement for the Fab Lab. I thought its usage was only for cutting vinyl, making signage, stickers, or shirt decals, and nothing more. However, you can cut an electronic circuit with it? Create a screen print? Every day you learn something new.
Assignments of The Week
Group Assignment
- Characterize your laser cutter's focus, power, speed, rate, kerf, joint clearance and types
Individual Assignment
- Cut something on the vinyl cutter
- Design, laser cut, and document a parametric construction kit, accounting for the laser cutter kerf, which can be assembled in multiple ways, and for extra credit include elements that aren't flat