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Application and Implication
What will it do?
The key finder medal will help people locate their keys. It consists of a remote and a target. When the user presses a button on the remote, it sends a signal to the target. The target, when activated, emits a beeping sound and activates a light, making it easier to find the keys.
Who's done what beforehand?
Similar products, such as iTags and other key finders, already exist in the market. These products utilize Bluetooth technology to establish a connection between a remote and a target to locate lost items.
What will you design?
You will design a key finder medal that includes a remote and a target. The remote will have a push button and an XIO ESP32C microcontroller. The remote will also be redesigned to be wearable on the hand for convenient usage. The target will have a buzzer, a light, a light sensor, and an XIO ESP32C microcontroller.
What materials and components will be used?
Materials:
- PCB board for remote (made with PCB fabrication using a PCB design software)
- Flexible and smooth TPU material for the target
- PLA material for the redesigned wearable remote
Components:
- XIO ESP32C microcontroller for both remote and target
- Push button for the remote
- Buzzer for the target
- Light module for the target
- Light sensor for the target
- Bluetooth Low Energy (BLE) module for communication
- Passive components (resistors, capacitors, etc.) for circuitry
- Rechargeable lithium battery (3.7V) for power
- Switch for on/off functionality on the remote
Where will they come from?
The materials and components can be sourced from electronic component suppliers, online retailers, or local electronics stores.
How much will they cost?
The cost of the materials and components will vary depending on the specific brands, quantities, and suppliers chosen. It is recommended to research and gather price estimates from different sources to determine the overall cost.
Bill of material
| Item | Description | Quantity | Unit Cost ($) | Supplier |
|---|---|---|---|---|
| Phototransistor | Phototransistor(photo_sensor) | 1 | ~0.50 | Alibaba |
| ESP32C3 | ESP32C3 microcontroller | 1 | ~5.00 | seeedstudio |
| LED | LED (blue and red) | 2 | ~0.50 | Microelectron-Jordan |
| 10k Resistor | Resistor (10k ohm) | 1 | ~0.50 | Microelectron-Jordan |
| material and 3d printing cost | PLA material | 35 gram | each gram cost .3 total will be ~10.5 | Techworks-Jordan lab |
| carton material and laser cutter for packaging | carton material | 1 piece size(60*60 cm) | ~1 | Techworks-Jordan lab |
| vinal cutter sticker | sticker material | 1 piece size(20*20 cm) | ~.5 | Techworks-Jordan lab |
| copper sheet for pcb | A8 Double Side 5*7cm thickness 1.5mm copper sheet | 1 piece | ~1.5 | Microelectron-Jordan |
| Buzzer | Buzzer (specify details if necessary) | 1 | ~0.80 | Microelectron-Jordan |
| Total Cost: | ~20.8 JD (Jordanian dinar) | |||
What parts and systems will be made?
In my project, several parts and systems will be made to bring the whole system together. These include:
-
PCB Board for target device:
The target will have a customized PCB board. I will design the PCB layout using specialized software and then manufacture it using PCB fabrication methods. This board will house the necessary components and provide the interface for controlling the system.
-
Enclosure:
To protect and house the electronic components, I will design an enclosure using CAD software such as Fusion 360. The enclosure will be designed to fit the dimensions of the PCB board, buttons, and other components. I will then utilize a 3D printer to manufacture the enclosure, ensuring a precise fit and a professional finish.
-
Box Package:
I will create a box package to provide a complete and visually appealing presentation. Using a laser cutter, I will cut the design from a sturdy material such as carton. This box package will serve as an attractive and protective casing for the remote control system, enhancing its overall presentation and user experience.
By developing these parts and systems, including the PCB board, enclosure, and box package, I aim to create a comprehensive and well-designed solution that combines functionality with aesthetics. Each component will be carefully designed and manufactured to ensure the proper functioning and professional appearance of the overall system.
What processes will be used?
The processes involved in the project may include:
- Designing the remote and target using CAD software
- Designing the PCB layout using PCB design software
- PCB fabrication for the remote
- Soldering and assembly of electronic components onto the PCB
- Programming the microcontrollers for both remote and target
- Testing and troubleshooting the functionality of the key finder system
What questions need to be answered?
Some questions that need to be answered during the project may include:
- How to optimize power consumption for extended battery life?
- How to ensure reliable and secure communication between the remote and target?
- How to design an intuitive user interface for the remote?
- How to calibrate the light sensor for accurate detection?
- How to optimize sound come from target inclosure ?
How will it be evaluated?
The key finder medal can be evaluated based on its effectiveness in locating keys, the reliability of the Bluetooth communication, the responsiveness of the remote button, the convenience and wearability of the redesigned remote, and the overall user experience. User feedback and testing can be used to assess the performance and usability of the key finder medal.
| Component | Remote | Target |
|---|---|---|
| Microcontroller | XIO ESP32C | XIO ESP32C |
| Material | PLA | TPU |
| Button | Push Button | --- |
| Buzzer | --- | Buzzer |
| Light | --- | Light Module |
| Light Sensor | --- | Light Sensor |
| power | Li battery 3.7 V | Li battery 3.7 V |
| Functionality | Send Bluetooth signal to activate the target | Emit beeping sound and activate light when triggered |
| specification & Modification | Make it wearable on hand,make its enclosure easy to open for maintenance purpose | work on attachment method, Investigate different materials for enhanced durability or flexibility |
Final Project Schedule
| Date | Activities |
|---|---|
| 24/5/2023 | Begin final project preparation |
| 25/5/2023 | Create circuit boards for remote and target devices |
| 26/5/2023 | off |
| 27-28/5/2023 | Program a mobile application using MIT App Inventor |
| 29/5/2023 | Solder components onto the circuit boards |
| 30/5/2023 | Take measurements of the target board for the enclosure design & Design the target enclosure using Fusion 360 |
| 31/5/2023 | Print the first version of the target enclosure using a 3D printer |
| 1/6/2023 | Modify the design based on measurement errors and reprint the target enclosure |
| 2/6/2023 | Encounter and resolve problems with 3D printing the modified target enclosure |
| 3/6/2023 | Begin the assembly process, combining all the components to create the target device |
| 4/6/2023 | Work on designing the packaging for the product using a laser cutter |
| 5/6/2023 | Continue working on the packaging design |
| 6/6/2023 | Complete the packaging design |
| 7/6/2023 | cut and assemble the packaging, including gluing |
| 8/6/2023 | Use a vinyl cutter and Inkscape software to create a sticker for the project logo |
| 9/6/2023 | Focus on documentation preparation |
| 10/6/2023 | Work on creating the final video and slides for the project presentation |
| 11/6/2023 | Continue refining the video and slides |
| 12/6/2023 | Finalize the documentation, video, and slides |
| 13/6/2023 | Review and make any necessary adjustments to the project and test it & Practice and prepare for the final presentation |
| 14/6/2023 | Present the final project |