Assignment items

Individual assignment

Fab Academy Rubric — Have you?
The criteria evaluators look for this week.





The process

Individual assignment:


plan for system integration final project design steps you have taken within your final project DFM (Design for Manufacturing) flexures vs fasteners vs adhesives wire routing surface finish QA (Quality Assurance, defect prevention) QC (Quality Control, defect detection) shake drop environmental fuzzing Implemented methods of packaging Conceptual design perliminary design Dteiled design

Schedual

the ideal oprion was to finlise different part as I go with weeksof FabLab program. Unfutureanly in 2026 a ware strated in teh region and it effected two main cretical factors. First the availabilit y and supplier of the inventory needed to fulfil the assignemnets; this cused huge stress as wellas accumilation of the assignements to be done in a very short time. Second, I hold a leadedreship positionin WRO Kuwait, and I Made sure since OCT 205 that I prepare and organize my work in a way it doesnt effect my commitment to FabLab. Unfortuanlity, Due to the war, my 8 month previous plan had no value and I had to not only accure financial loss, but also restrategies and replan and reimplemenbt the full project in 2 month. and that effected my commitment to FalLab. I decided to take 3 weeks off FabLab (W14-W15-W-16) to finlize everything to be able to commit to Fablab until Jun and make sure I complet all assignments for graduation in Jun.


01: The design


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01 | To create a shoulder clips

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02 | The interface application

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03 | The charging case to hold the two clips

02: Components


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01 | To create a shoulder clips; PCB with ESP23-C3 + MUP GY512 + VibratorMoter drive+ charchable batery + LED lightbulb, Magnets, 3D case with clip

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02 | The interface application; make sure the application is connected to the clips and the wrieless case

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03 | The charging case to hold the two clips; Wodden case + wireless charging model + ESP23-C3 +LED light + Magnets

03: Assembeling plan workflow


Shoulder Clips:
Update designing PCB Milling PCB soldering the Microcontroller and sensors to PCB QC-testing for short circuits upload program to Microcontroller QA- testing using external battery soldering rechargeable battery QC- testing functionality and estimate charging duration fitting Components in the case connecting to APP and testing

Wireless Charging Case:
Update designing PCB Milling PCB soldering the Microcontroller and sensors to PCB QC-testing for short circuits upload program to Microcontroller QA- testing using external battery soldering rechargeable battery QC- testing functionality and estimate charging duration fitting Components in the case connecting to APP and testing

Interface App:
Update designing PCB Milling PCB soldering the Microcontroller and sensors to PCB QC-testing for short circuits upload program to Microcontroller QA- testing using external battery soldering rechargeable battery QC- testing functionality and estimate charging duration fitting Components in the case connecting to APP and testing

03: Assembeling


ShoulderClip:
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01 | After the ESP32 cE supper mini that I was using burned in my previous test, I switched to XIAO ESP32 C3 nd updated my Schematics deisgn adding RBG LED and a charging modular for the lithiom battery

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02 | I also rewired the PCB routs and rearranged the components, I also found that I will not need the Charging moduler while using the XIAO and thus pushing the battery to the back so that it connect to the Battery on XIAO

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03 | This is teh 3D render, and becuase I did not find the footprint of the Vibrator moter, the RBG LED I'm using nore the batery, I measure their side and added and border that define the sizes of the components on the PCB. Specially that my project is a wearable clip, thus the size and the weight of the final clip are important.

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04 | Unfortuanatily and unexpected thing happened and the milling machien was out of oerder and I have to postponce producing my PCB. I will also try to approch two university and check the posibility for me to use their labs.

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05 | my plan B was to print the curcit 3D, and while I was designing, I found a solution for a problem I had with the pre soldered pins of the drivers. and I really enjoyed creating the slanted routs.

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06 | Looked very coooooool and I added "irroning Top Surface" to make sure the curface will be smoother to have copper tap on the routs

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07 | and this is how it Looks, each compenent in its own pocket and I didnt have to remove the pins. the design still need to be fixed to and I need a sharper cutter to cut the copper tap. it will also be eacy to create a case of the clip.

04: Testing


areas of testing Findings
How durable is the clips if they fill down or where shoock hard?
How durable is the clicaseps if they fill down or where shoock hard?
what is the lowest velue of vibration that can be filt when the clip is worn?
Will the magnets effect the value of the MPU sensor?
how long dose it take for a full battery charge?
How long (duration) can the clip be used from one complete charge?
How long will the clip be connected via bluetooth to the App?
How long will it take for a full charge using the wireless charger?
How well are the magnets in the clips aliged with the magnets in the case?
WIP!!
  • Feedback: This is still a work in progress, but I feel confident I can finish quickly because the plan is clear — I just need time to execute.
  • Challenge: I will need access to a milling machine to prepare the new PCB and compare testing with the 3D-designed sample.

Reflection

What worked
  • Breaking the final project into three clear subsystems — shoulder clips, charging case, and interface app — made the integration plan easy to reason about.
  • Writing the assembly steps as an explicit workflow surfaced the right order of operations before building anything.
  • Laying out a testing table early gave me a concrete checklist to validate against.
What didn't
  • The wireless charging case is still the least-defined subsystem.
  • I don't yet have reliable milling-machine access to produce the integrated PCB.
  • The testing table is written but not yet filled in with real results.
What I'd do differently
  • Define the packaging and enclosure constraints earlier, so electronics and case design could progress together.
  • Secure machine access ahead of the integration week instead of during it.
  • Run a few tests as each subsystem is finished, rather than batching all testing at the end.
Key learnings
  • System integration is mostly sequencing — knowing what has to be done before what.
  • A clear assembly plan turns a vague "finish the project" into a list of doable steps.
  • Quality checks (QC) and quality assurance (QA) need to be planned in, not bolted on at the end.