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2. Hardware

2.1 System block diagram

  • Core Control Layer: The Seeed Studio XIAO ESP32S3 serves as the main control unit, utilizing its dual-core 240 MHz processor to achieve multitasking scheduling.
  • Audio Processing Layer: The MAX9857 Class D amplifier delivers 3W stereo output and receives audio data via the I2S digital audio interface.
  • Display Interaction Layer: A GC9107 0.85-inch LCD screen (128x128 RGB) provides a graphical interface via the SPI interface.
  • User Input Layer: A capacitive touch button uses GPIO interrupts for detection and supports single-click and long-press event recognition.
  • Status Indication Layer: An RGB LED achieves multicolor status indication through PWM dimming.
  • Power Management Layer: Powered through a USB Type-C input, A 200mAh Li-ion battery provides power for the entire system.

2.2 Schematic

Main Control Interface Design:

  • I2S0 Bus: Connected to the MAX9857

    • BCLK: D8
    • WS: D7
    • DATA: D9
  • SPI Bus: Drives the GC9107

    • SCK: D6
    • MOSI: D5
    • CS: D1
    • DC: D2
    • BL (Backlight): D0
  • GPIO Multiplexing Configuration:

    • Button: D9
    • LED: D6

Key Circuit Designs:

  • Audio Power Amplification:

    • MAX9857 uses differential output configuration (OUT+ / OUT-)
    • 100nF decoupling capacitor array
  • Display Driver Optimization:

    • 100nF decoupling capacitor array
  • Button Design:

    • 10K pull-up resistor
  • LED Design:

    • 1K pull-up resistor

2.3 PCB

Button Cutout Design:

  • A 2 mm keepout zone is added around the tactile button (SW1).
  • Ground pour is removed under the button area.
  • PCB edge clearance of 3 mm is reserved to allow button travel.

Layer Stackup:

  • 2-layer board (1.6 mm FR4)

    • Top Layer: Signal and power routing
    • Bottom Layer: Continuous ground plane

Critical Component Placement:

  • The audio amplifier (MAX9857) is isolated from digital components to minimize interference.
  • The LCD connector is aligned with the board edge for easy assembly and accessibility.

2.4 2D & 3D rendering

After the PCB is completed, the 2D and 3D rendering are done.

2.5 Soildering

2.6 Testing

2.7 Resources

SmartGlassesKit