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Assignments:

• Individual assignment: Propose a final project masterpiece that integrates the range of units covered,
  answering:
  What will it do?
  Who's done what beforehand?
  What will you design?
  What materials and components will be used?
  Where will come from?
  How much will they cost?
  What parts and systems will be made?
  What processes will be used?
  What questions need to be answered?
  How will it be evaluated?
  Your project should incorporate 2D and 3D design, additive and subtractive fabrication processes, electronics design and production, embedded microcontroller interfacing and programming, system integration and packaging
  Where possible, you should make rather than buy the parts of your project
  Projects can be separate or joint, but need to show individual mastery of the skills, and be independently operable

My project:

• What will it do?
  My project is going to be a guest book that uses NFC to track it's guests. To sign in to the book you are going to use an app on your phone. The device will use temprature sensor to keep track of the heat that is in the ground, barometer sensor to sens air pressure on top of the mountaina. It will also display the temperature in the ground and also the air pressure on a screen that will be on the device. The device will also use a bluetooth chip to connect to the phone.


• Who's done what beforehand?
  Smart citizen is a project that is most similar to mine. The project are sensors that collect urban data.


• What will you design?
  I will desing and make the circuit board, case and the app for the project.


• What materials and components will be used?
  The materials that will be used are a 16x2 lcd screen, baometer sensor and a temperature sensor. It will also use a bluetooth chip to connect to the phone.


• Where will come from?
  


• How much will they cost?
  
  • 16x2 LCD screen:
  • Barometer sensor:
  • Temperature sensor:
  • Bluetooth chip:


• What parts and systems will be made?
  The parts that will be made are the box that keeps the circuit board safe from weather, all of the circuitboards.


• What processes will be used?
  I will use a 3D sacnning to scan a stone and will the shell look like a stone to blend in, 2D and 3D designing to design the project, input and output devices to make the screen and sensor work properly, computer controlled machining to make the case and circuit board, electronics design and production to design and make the circuitboard, networking and comunications to make the device able to connect to phone.


• What questions need to be answered?
  How will I make the case moisture free?
  How will I connect the app to the device?
  How will I connect all the parts?


• How will it be evaluated?