Week 15 – System Integration

Integration of the mechanical, electronic, sensing, control and monitoring systems into the final FAB ENCLOSER prototype.

Project Overview System Integration

During this week all the individual developments completed throughout Fab Academy were integrated into a single functional system. The objective was to combine mechanical design, electronics production, embedded programming, interface development, sensing, and output devices into the final FAB ENCLOSER prototype.

The FAB ENCLOSER is a controlled environment designed to improve the reliability of 3D printing by maintaining stable environmental conditions. The system continuously monitors temperature and humidity while controlling internal heating and ventilation.

This week represented the transition from isolated subsystems to a complete product capable of operating as a single integrated machine.

System Architecture Concept Design

Before beginning assembly, a complete system architecture was developed to define the relationship between all hardware components. The enclosure contains sensing, processing, visualization, heating, ventilation and monitoring systems connected to a central controller board.

The architecture was designed around a custom PCB developed during the Electronics Design and Electronics Production assignments. This board acts as the central hub that communicates with sensors and output devices.

FAB ENCLOSER System Architecture
Initial integration sketch showing mechanical layout, electronic components and wiring distribution.
Integrated Subsystems Hardware Overview

The final enclosure integrates multiple subsystems that were individually developed throughout the Fab Academy process.

Subsystem Function Related Week
Custom PCB Central electronic controller Weeks 6 & 8
SHT31 Sensor Temperature and humidity measurement Week 9
Cooling Fan Air extraction and temperature regulation Weeks 9 & 10
OLED Display Local system monitoring Week 11
Heater Temperature increase inside enclosure Final Project
Raspberry Pi 5 Image processing and remote monitoring Final Project
Camera Module Live visualization of printing process Final Project
Qt Interface Remote control dashboard Week 14
Mechanical Integration Enclosure Structure

The enclosure structure was designed to provide a thermally controlled environment while maintaining visibility of the printing process.

The body of the enclosure was designed using galvanized steel panels due to their rigidity, durability and resistance to elevated temperatures.

According to the design sketch, the enclosure consists of:

  • Galvanized steel body panels
  • Galvanized steel top cover
  • Galvanized steel bottom panel
  • Two transparent acrylic doors

Acrylic doors were selected to allow visual inspection of the printer while maintaining thermal isolation.

The enclosure dimensions were established around the size of the 3D printer and future electronic components while maintaining sufficient internal airflow.

Electronic Integration Control System

The custom PCB serves as the central electronic controller for the entire system. All sensors, displays and actuators are connected directly to this board.

The board integrates:

  • ESP32-C3 microcontroller
  • SHT31 temperature and humidity sensor
  • OLED display
  • Fan control outputs
  • Power regulation circuitry
  • User input buttons

This centralized architecture simplifies wiring and reduces the number of independent modules required inside the enclosure.

Environmental Monitoring Input Devices

Environmental conditions are continuously monitored using an SHT31 digital sensor.

The sensor provides:

  • Temperature measurements
  • Relative humidity measurements

Data is transmitted through the I²C communication protocol to the ESP32 controller.

The measured values are displayed locally on the OLED screen and can also be transmitted to the remote monitoring interface.

Environmental Control Output Devices

Two main actuators are responsible for controlling the internal environment:

  • Heating element
  • Exhaust fan

The heater increases the internal temperature when necessary, while the fan removes hot air to prevent overheating.

The control logic is based on sensor measurements. When the temperature exceeds a predefined threshold, the fan is activated automatically. Future versions will implement PID control for improved thermal regulation.

Raspberry Pi Integration Computer Vision

A Raspberry Pi 5 equipped with a camera module is integrated into the enclosure for real-time monitoring of the printing process.

The Raspberry Pi serves several purposes:

  • Remote video streaming
  • Print monitoring
  • Future AI-based failure detection
  • Remote user interaction

The camera is positioned to observe the print area and provide continuous visual feedback through the desktop interface.

User Interface Integration Qt Dashboard

The monitoring dashboard developed during Week 14 acts as the primary user interface for the enclosure.

Through this application the user can:

  • Monitor temperature
  • Monitor humidity
  • View live camera feed
  • Control heating
  • Control ventilation
  • Activate emergency stop functions

The interface centralizes all system information into a single control panel, improving usability and enabling future remote access.

Power Distribution Electrical System

The entire enclosure is powered through a 12V power supply connected to the AC mains.

This supply distributes energy to:

  • Electronic controller board
  • Cooling fan
  • Heating element
  • Display system
  • Additional peripherals

A dedicated power switch was incorporated to provide safe startup and shutdown procedures.

Reflection

System Integration was one of the most important stages of the project because it transformed multiple independent developments into a complete and functional product.

Throughout Fab Academy, each assignment focused on a specific technology or fabrication process. This week demonstrated how all those skills can be combined into a unified engineering system.

The FAB ENCLOSER now integrates mechanical design, electronics, embedded programming, sensing, computer vision and user interface development into a single platform capable of monitoring and controlling the 3D printing environment.

This integration represents the foundation for the final project and demonstrates the complete digital fabrication workflow learned during Fab Academy.