4. Computer controlled cutting¶
This week we started working with machines and materials. The first machines are the Laser Cutter and the Vinyl Cutter!!!
Group Assignment¶
In the lab we have a 48 Epilog Fusion Pro, which allows a working area of 1219 x 914 x 311 mm. The lasser cutting machine is a 50 watt CO2 one.
The seller recommended parameters for acrylic and wood are:
We started doing some tests using the recommended parameters
We used the available materials in the laboratory and we determined the following parameters:
| Acrylic 3mm | Engraving | Cutting |
|---|---|---|
| Resolution | 300 | – |
| Speed | 80 | 18 |
| Power | 40 | 100 |
| Frequency | – | 100 |
| MDF 3mm | Engraving | Cutting |
|---|---|---|
| Resolution | 500 | – |
| Speed | 50 | 20 |
| Power | 100 | 100 |
| Frequency | – | 10 |
To determine the kerf on the available materials and due to there were no digital vernier, we experimented with cutting 10 spaces and then measuring the slit in mm.
- The kerf for 3mm Acrylic is 0.25mm
- The kerf for 3mm MDF is 0.5 mm
- The kerf for 4.25mm Cardboard is 0.2mm
To check and have an exact measurement of the kerf and joint clearance we constructed a joint pattern with different subtracted measurements.
The parameters por engraving acrylic and mdf were satisfactory after a previous test
Individual Assignment¶
With the kerf and joint clearance well defined, a cardboard lamp was designed with the non-parametric software Adobe Illustrator.
Another practical way to test the kerf and joints was using the Tinkercad and Slicer software to generate the plans and fabricate a 1:5 scale seat.
Then, I designed in 2D parametrically using Autocad a hexagon to be cut out of cardboard.
The cardboard available was 4.25 mm thick and the kerf measured in both ways mentioned above is 0.54 mm. In addition, a chamfer was cut at each joint for better assembly.
Vinyl cut¶
Finally, the vinyl cutter available in the lab is a GCC Expert II 24” model that can load materials up to a maximum width of 600 mm. The cutter has a standard 45° blade.
The vinyl cutting process is not very complex, you only have to set the parameters recommended by the supplier:
| Adhesive Vinyl 290gr/m² | Values | Observations |
|---|---|---|
| Velocidad | 21 | the greater the complexity, the higher the speed |
| Force | 85 | the thicker the material, the greater the strength |
| Offset | 0.25 | the deeper the cut, the greater the offset |
The Fab Lab logo and the Architecture and Urbanism Faculty logo were designed and cutted
The process of transferring the cut design to the final surface is aided with an adhesive transfer tape
Files¶
- Kerf Autocad file
- Lamp AI file to DXF
- Seat Tinkercad file
- Hexagons Autocad file
- Vinylcut Autocad file